SV1121A

AMD 1 OU Modular Server 

  • - AMD EPYC™ Platform Solution
  • - 12-Channel RDIMM DDR5, 24 x DIMMs
  • - Support E1.S Drives
  • - Up to 4 x PCIe 5.0 x16 Slots
  • - Air/Liquid Cooling Solution

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intel

Application


Hyperscale Data Center


Enterprise Application Server


High Performance Computing


AI and Machine Learning

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Modular Design to Create Multiple Systems

Ingrasys develops a game-changing approach to break down the legacy servers into reusable modular components, and mix and match them to build up multiple new systems. This approach creates unlimited possibilities and allows for future scalability across different generations of platforms.

One Module, Maximum Flexibility

Reuse the modules as much as possible. When the system needs to be updated, only replace one module with a new one with no other changes required.

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Support Enterprise EIA 19" and ORv3 Racks

Use the same modular components differently to configure systems respectively for Enterprise EIA 19” rack and Open Compute ORv3 rack.

Rack-integrated Liquid Cooling Solution

Ingrasys OCP-compliant server supports liquid cooling technology to provide higher cooling efficiency, which allows high-power CPU and GPU to run at their full performance while reducing significant energy consumption.

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