SV1120I
Intel 1 RU Modular Server
Powered by 4th Gen Intel® Xeon® Scalable Processors
8-Channel RDIMM DDR5, 32 x DIMMs
Support E1.S/U.2 Drives
2 x PCIe 5.0 x16 FHHL Slots
Air Cooling Solution
8-Channel RDIMM DDR5, 32 x DIMMs
Support E1.S/U.2 Drives
2 x PCIe 5.0 x16 FHHL Slots
Air Cooling Solution
Powered by
Application
Hyperscale Data Center
Enterprise Application Server
High Performance Computing
AI and Machine Learning
Modular Design to Create Multiple Systems
Ingrasys develops a game-changing approach to break down the legacy servers into reusable modular components, and mix and match them to build up multiple new systems. This approach creates unlimited possibilities and allows for future scalability across different generations of platforms.
One Module, Maximum Flexibility
Reuse the modules as much as possible. When the system needs to be updated, only replace one module with a new one with no other changes required.
Support Enterprise EIA 19" and ORv3 Racks
Use the same modular components differently to configure systems respectively for Enterprise EIA 19” rack and Open Compute ORv3 rack.
| Processor | 2 x 4th Gen Intel® Xeon® Scalable Processors |
| Memory |
32x DDR5 RDIMMs, 8-Channel, up to 4800 MT/s at 1DPC, 4400 MT/s at 2DPC |
| Storage |
|
| Expansion Slots |
2 x PCIe 5.0 x16 FHHL Slots 1 x PCIe 5.0 x16 OCP NIC 3.0 |
| Security & Management | DC-SCM 1.0 (Root of Trust, TPM, AST2600 BMC) |
| Cooling Solution | 8 x 4056 Dual Rotor System Fans (N+1 Redundant), CPU Remote Heatsink |
| Power Supply | 2 x 2400W Platinum Redundant (1+1) PSU |
| I/O Ports | 1 x 1GbE/RJ45 Management Port 1 x USB 2.0 1 x Mini Display Port 1 x Reset Button 1 x Power Button with LED 1 x UID Button with LED |
| Chassis Dimensions (H x W x D) | 1.71"x 17.32"x 32.4"/ 43.4mm x 440.0mm x 823.4mm |
