Head Node Server
Hyperscale Data Center
High Performance Computing
Software-Defined Storage
Enterprise Application Server
Virtualization
The Intel’s first 10nm 3rd generation Intel® Xeon® scalable processors empower the system to support dynamic computational workloads, and accelerate business outcomes through significant breakthrough in core architecture, performance and security.
The standard-compliant OCP 3.0 slot enables the installation of a high-speed NIC card, which delivers high bandwidth and ultra-low latency in a cluster environment.
The server supports either 2 PCIe FHHL cards or 3 PCIe LP cards in a slim 1U form factor, providing great flexibility as well as versatile I/O capability.
Processor | One/Two 3rd Gen. Intel® Xeon® Scalable Processor(s) |
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Memory | Up to 32 x DDR4 3200MHz RDIMM/LRDIMM Support Intel Optane Persistent Memory 200 Series Module |
Storage |
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Front Panel |
1 x Power Button with LED 1 x UID Button with LED / 1 x Reset Button 1 x System Health LED |
Rear Panel |
2 x FHHL Cards or 3 x LP Cards 1 x RJ45 for BMC Dedicated Management 1 x VGA / 2 x USB 3.0 1 x Power Status LED / 1 x UID LED 1 x System Health LED |
Security |
1 x TPM 2.0 Module Lattice MachXO3D Root-of-Trust Engine |
Management | 1 x ASPEED AST2500 BMC per Node Support Intelligent Platform Management Interface v.2.0 |
PSUs | 1+1 Redundant 1600W Platinum Power Supplies |
Fans | 8 x 40*56mm Dual Rotor System Fans |
Certification | UL/ CB/ CE/ FCC/ IC/ BSMI |
OS Certification | Windows Server 2022, VMware ESXi 7.0 U2/ 7.0 U3 |
Chassis Dimensions (H x W x D) |
1.71" x 17.32" x 29.88"/ 43.5mm x 440.0mm x 777.8mm |
Form Factor | 1U Rackmount |
Operating Temperature | 0°C to 35°C (32°F to 95°F) |
Non-operating Temperature | -40°C to 70°C (-40°F to 158°F) |
Operating Relative Humidity | 8% to 85%RH |
Non-operating Relative Humidity | 5% to 95%RH |
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