Divide systems into modular components, and mix and match them to create multiple configurations


Customize components (e.g. HPM, DC-SCM ) without changing other modules to meet customer-specific needs


Configure new systems in chassis for Enterprise EIA racks or ORv3 racks, using the same components in different ways


Re-use modular components as much as possible to achieve faster time-to-market for customers

Host Processor Module (HPM)

  • Develop one HPM for each CPU family from each CPU supplier
  • Build a HPM for a customer-specified CPU (such as non-x86), and re-use all the other chassis and modules
  • DC-SCM v1.0

  • Develop one DC-SCM that can be used across different HPMs and different system configurations
  • Build a customized DC-SCM used across different systems without changing any complex HPMs
  • OCP NIC 3.0

  • Install one of a large variety of OCP NIC 3.0 modules from multiple suppliers, including NVIDIA, Intel, Broadcom, Marvell, and others
  • Drive Cages & Interposers

  • E1.S NVMe drives
  • 2.5” NVMe, SAS or SATA SSDs
  • 2.5” SAS or SATA HDDs
  • E3.S NVMe SSDs
  • E3.S CXL memory modules
  • E1.S CXL memory modules
  • PCIe CEM Card Modules

  • Install one of a large variety of PCIe CEM cards, in FHHL or smaller form factors
  • Support standard GPU card form factors in some chassis

  • We are dedicated to customizing new modules and system configurations that suit your business needs. If you would like to learn more, please contact us for details.