Pair Performance with Efficiency
Ingrasys Intel Xeon 6 processor-based server platforms offer a significant performance boost for targeted workloads compared to the previous generation, covering from general purpose to compute-intensive workloads. With built-in accelerators, support for PCIe Gen5, DDR5 memory, and Compute Express Link™ (CXL) 2.0, these platforms enhance computing capability and I/O bandwidth while reducing both costs and carbon footprint. Ingrasys systems leverage the Intel Xeon 6 processor’s two core types — performance-cores (P-cores) and efficient-cores (E-cores) — to address different computing needs. Organizations can mix systems with each core type to support diverse workloads and easily scale as their business grows.
Hybrid Architecture
Performance-core for AI and analytic workloads;
Efficiency-core for cloud native and hyperscale workloads
Built-in Accelerators
Accelerate AI processing for faster model training and real-time predictions
Advanced
Security
Support confidential computing
to protect sensitive data in use
Up to 128 P-cores
per CPU
Up to 288 E-cores
per CPU
12 Channels of
DDR5
PCIe 5.0
Lanes
CXL 2.0
Support
Featured Product
Ingrasys Modular Servers are designed with performance, flexibility, and future-proof, tailored to meet the evolving needs of modern data centers. With support for Host Processor Module (HPM), these servers ensure compatibility with next-generation Intel® Xeon® processors without changes to other modular components, offering a scalable and efficient solution that adapts to future advancements in processor technology. The modular design enables seamless upgrades and maximizes resource efficiency, making Ingrasys's modular servers ideal for what's next in the data center landscape.
SV2221I
- CPU: 2 x Intel® Xeon® 6 Processors
- Memory: 32x DDR5 RDIMMs, 8-Channel, up to 6400 MT/s at 1DPC, 5200 MT/s at 2DPC
- Expansion Slot: 2 x PCIe 5.0 x16 FHHL Slots, 8 x PCIe 5.0 x16 LP/HHHL with Riser Card Slots
- Power Supply: Centralized 48V Bus Bar with PDB
- Form Factor: 2 OU Air-Cooled or Liquid-Cooled System
