Ingrasys Delivers HPC Solutions with the 4th Gen. Intel® Xeon® Scalable Processors



Modular Design



Our Modular Design Supports


- 4th Gen Intel® Xeon® Scalable platform
- Enterprise EIA19" and ORv3 two chassis family
- Both air-cooled & rack integrated liquid cooling
- Flexible I/O & drive configurations
- Reusable blocks: HPM, DC-SCM, OCP NIC 3.0, EDSFF storage





Intel® Xeon® - Based Products



Turing
SV1120I

  • 2 x 4th Gen Intel® Xeon®
  • 32 x DDR5 DIMMs
  • PCIe 5.0 Platform
  • Support E1.S/U.2 Drives
  • Air Cooling Solution
  • 1 RU

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    Turing
    SV1121I

  • 2 x 4th Gen Intel® Xeon®
  • 32 x DDR5 DIMMs
  • PCIe 5.0 Platform
  • Support E1.S Drives
  • Air/Liquid Cooling Solution
  • 1 OU

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    ...
    SV2121I

  • 2 x 4th Gen Intel® Xeon®
  • 32 x DDR5 DIMMs
  • PCIe 5.0 Platform
  • Air/Liquid Cooling Solution
  • 2 OU


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    ...
    SV1020I

  • 2 x 3rd Gen Intel® Xeon®
  • 32 x DDR4 DIMMs
  • PCIe 4.0 Platform
  • 12 x 2.5" NVMe/SATA Drives
  • 1 RU

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