Hyperscale Data Center
Enterprise Application Server
High Performance Computing
AI and Machine Learning
Ingrasys develops a game-changing approach to break down the legacy servers into reusable modular components, and mix and match them to build up multiple new systems. This approach creates unlimited possibilities and allows for future scalability across different generations of platforms.
Reuse the modules as much as possible. When the system needs to be updated, only replace one module with a new one with no other changes required.
Use the same modular components differently to configure systems respectively for Enterprise EIA 19” rack and Open Compute ORv3 rack.
Ingrasys OCP-compliant server supports liquid cooling technology to provide higher cooling efficiency, which allows high-power CPU and GPU to run at their full performance while reducing significant energy consumption.
Processor | 2 x 4th Gen AMD EPYC™ Server Processors |
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Memory | 24 x DDR5 RDIMMs, 12-Channel per CPU, up to 4800 MT/s at 1DPC |
Expansion Slots |
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Security & Management | DC-SCM 1.0 (Root of Trust, TPM, AST2600 BMC) |
Cooling Solution |
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Power Supply | Centralized 48V Bus Bar with PDB |
I/O Ports |
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Chassis Dimensions (H x W x D) |
3.68"x 21.14"x 31.76"/ 93.5mm x 537.0mm x 806.7mm |