2026 NVIDIA GTC
2026 NVIDIA GTC
  • Date
    March 16-19
  • Year
    2026
  • Location
    San Jose Convention Center, CA
  • Booth
    1921
Rack-Level Liquid Cooling

Rack-Level Liquid Cooling

Meet diverse cooling requirements across different data center environments
HOME solutions Advanced Cooling Technology Rack-Level Liquid Cooling
High Performance Liquid Cooling Solutions
 
 

High Performance Liquid Cooling Solutions

Ingrasys offers a complete line of rack-level liquid cooling solutions based on where the heat is exhausted in the data center. These solutions include options for exhausting heat entirely into the data center air, into the facility water, or a combination of both. Whether your data center is traditionally air cooled or liquid cooled, Ingrasys delivers high performance cooling solutions that suit your needs.

 

Features

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Higher Power Density

 

Employ direct liquid cooling technology to efficiently remove heat from heat-producing components such as CPUs or GPUs, enabling high-power chips to operate at peak performance.
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Great Cooling Capacity

 

Due to the close contact between the cooling liquid and the heat source, liquid-cooled systems delivers great cooling capacity, ensuring efficient heat dissipation while supporting compute-intensive applications.
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Easy Serviceability

 

The blind-mate connector ensures simple connections and front servicing of all rack components, including servers, 
hot-swappable fans, pumps, and PSUs of the RPU/CDU.
 
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Management Control System

 
An integrated control system monitors and manages key parameters such as liquid/air flow rate, liquid/air temperature, pump speed, and RDHx fan speed.

Liquid-to-Air Solution

 

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Scenario 1: In-Rack RPU with Rear Door Heat Exchanger

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Scenario 2: Sidecar (Model: LA0733)

Ideal for Air-cooled Data Center
80kW Cooling Capacity
Deploy in connection with an IT Rack(s)

Specification

Model Name LA0733
Cooling Mechanism Air-Assisted Liquid Cooling,
All Heat to Data Center Air (Sidecar)
Rack Size (W x D x H) ORv3 Liquid Cooling Rack, 600mm x 1068mm x 2285mm
Cooling Capability 80kW
Computing Node Flexible (Depending on the Connected IT Rack) 
Rack Deployment Support Multiple Racks

Cooling Kits

  • Modular RPU 
  • Radiator
Redundancy Fans (15+1), Pumps (2+1), and PSU (5+1)
Serviceability Front-Access, Hot-swappable Fans, Pumps, PSUs
Management Control
  • Smart Auto-control System
  • Remote Control Communication: Web UI &  Redfish API
  • Sensor Monitoring: Temperature, Pressure, Flow Rate, Liquid Level, Fan/Pump Status, and Leak Detection
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Liquid-to-Liquid Solution

 

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Scenario 1: In-Rack CDU

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Scenario 2: In-Row CDU
(Model: LL6003/LL13003/LL25003)

Ideal for Liquid-cooled Data Center
2500kW Cooling Capacity
Deploy in connection with an IT Rack(s)
Front Touch Panel for Easy Control

Specification

Model Name LL25003
Cooling Mechanism Liquid-to-Liquid,
Main Heat to Facility Liquid
Rack Size (W x D x H) 1200 x 1510 x 2256 mm
Cooling Capability 2500kW
Rack Deployment Support Multiple Racks

Cooling Kits

Plate Heat Exchanger
Redundancy N+1 Redundant Pumps
Management Control
  • Smart Auto-control System
  • Remote Control Communication: TCP/IP & RS485 RTU Modbus
  • Sensor Monitoring: Temperature, Pressure, Flow Rate, Liquid Level, Pump Status, and Leak Detection
Ideal for Liquid-cooled Data Center
600/1300kW Cooling Capacity
Deploy in connection with an IT Rack(s)
Front Touch Panel for Easy Control
Specification
Model Name LL6003/LL13003
Cooling Mechanism Liquid-to-Liquid,
Main Heat to Facility Liquid
Rack Size (W x D x H) LL6003: 800mm x 1200mm x 2100mm
LL13003: 900mm x 1250mm x 2160mm
Cooling Capability LL6003: 600kW
LL13003: 1300kW
Rack Deployment Support Multiple Racks

Cooling Kits

Plate Heat Exchanger
Redundancy N+1 Redundant Pumps
Management Control
  • Smart Auto-control System
  • Remote Control Communication: TCP/IP & RS485 RTU Modbus
  • Sensor Monitoring: Temperature, Pressure, Flow Rate, Liquid Level, Pump Status, and Leak Detection
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