SV2221I
Intel 2 OU Modular Server
Powered by Intel® Xeon® 6 Processors
8-Channel RDIMM DDR5, 32 x DIMMs
Up to 10 x PCIe 5.0 x16 Slots
Air/Liquid Cooling Solution
8-Channel RDIMM DDR5, 32 x DIMMs
Up to 10 x PCIe 5.0 x16 Slots
Air/Liquid Cooling Solution
Powered by
Application
Hyperscale Data Center
Enterprise Application Server
High Performance Computing
AI and Machine Learning
Modular Design to Create Multiple Systems
Ingrasys develops a game-changing approach to break down the legacy servers into reusable modular components, and mix and match them to build up multiple new systems. This approach creates unlimited possibilities and allows for future scalability across different generations of platforms.
One Module, Maximum Flexibility
Reuse the modules as much as possible. When the system needs to be updated, only replace one module with a new one with no other changes required.
Support Enterprise EIA 19" and ORv3 Racks
Use the same modular components differently to configure systems respectively for Enterprise EIA 19” rack and Open Compute ORv3 rack.
Rack-integrated Liquid Cooling Solution
Ingrasys OCP-compliant server supports liquid cooling technology to provide higher cooling efficiency, which allows high-power CPU and GPU to run at their full performance while reducing significant energy consumption.
| Processor | 2 x Intel® Xeon® 6 Processors |
| Memory | 32x DDR5 RDIMMs, 8-Channel, up to 6400 MT/s at 1DPC, 5200 MT/s at 2DPC |
| Expansion Slots | 2 x PCIe 5.0 x16 FHHL Slots 8 x PCIe 5.0 x16 LP/HHHL with Riser Card Slots |
| Security & Management |
DC-SCM 2.0 (Root of Trust, TPM, AST2600 BMC) |
| Cooling Solution |
|
| Power Supply |
Centralized 48V Bus Bar with PDB
|
| I/O Ports | 1 x 1GbE/RJ45 Management Port 1 x USB 2.0 1 x Mini Display Port 1 x Reset Button 1 x Power Button with LED 1 x UID Button with LED |
| Chassis Dimensions (H x W x D) | 3.68"x 21.14"x 31.8"/ 93.5mm x 537.0mm x 809.5mm |
