Ingrasys Unveils Next-gen AI and Cooling Solutions at Supercomputing 2023
Denver, Colorado (Nov, 2023) – Ingrasys, a global leading cloud IT and infrastructure provider, announced today its participation at Supercomputing 2023 on November 14- 16 at the Colorado Convention Center. Focusing on paving the way for next-generation AI-enabled applications and services, Ingrasys will unveil its all-new, liquid-cooled AI servers, as well as its advanced liquid cooling racks, to share its latest efforts in building and pioneering sustainable solutions for the AI era.
As data centers face rising power consumption and cooling challenges, fueled by the demands of AI and high-performance computing, Ingrasys has been developing eco- conscious liquid cooling solutions to improve data center efficiency and sustainability. In booth 2125, Ingrasys will display its newest AI liquid server, the GB6181, which hosts eight NVIDIA H100 Tensor Core GPUs to deliver a staggering 32 petaFLOPS of performance for giant-scale AI and LLM inference and training and can be easily integrated into OCP ORv3 racks that customers’ data centers can deploy.
Two new additions to the modular building block series, the SV1123A and SV1143A, are making their debut. The two high-density 1-node and 2-node modular servers feature liquid cooling technology and support NVIDIA’s latest PCle GPUs, such as NVIDIA L40S and NVIDIA L4 Tensor Core GPUs, for unparalleled AI and graphics performance. The front-flexible modules allow different configurations of E1.S, U.2, and two PCIe form factors, meeting diverse needs and applications.
Visitors will also have a chance to explore the LA0763, an OCP ORv3 side-car liquid- cooling solution that has a high cooling capacity of up to 76kW and features a modular RPU (reservoir and pumping unit) and radiator. The side-car solution can be seamlessly deployed alongside IT racks without the need to modify the existing data center infrastructure, which not only saves considerable deployment time but also makes it an efficient choice for data center operators aiming to enhance cooling capabilities while maintaining operational continuity.
Other innovative displays include the high-performance NVMe-oF storage system featuring the NVIDIA Spectrum-2 Ethernet switch to deliver high throughput with low- latency, HPC servers featuring the NVIDIA GH200 Grace Hopper Superchip and NVIDIA Grace CPU Superchip for the surging demand of generative AI, as well as achievements in immersion cooling technology that significantly reduce data center power consumption. As always, Ingrasys continues to empower customers with the right solutions they need in today’s dynamic world.
View Chinese source version here: https://www.cna.com.tw/news/afe/202311150178.aspx
