Ingrasys to Unveil Innovative Modular Server at Computex 2022

Ingrasys, a subsidiary of Foxconn Industrial Internet (Fii) and a member of Hon Hai Technology Group (Foxconn), announced that it will make its debut at Computex 2022 to unveil its latest cloud-to-edge solutions that focus on the theme "Your Data, Our Mission" at its virtual booth.

The company will deliver a series of "Ingrasys Inspiring Tech Talks" on May 23 to outline its great advances in product strategy, modular architecture, edge product offerings, and advanced cooling solutions. Ingrasys Virtual Booth, "Your Data, Our Mission," is open from May 20, 2022, onwards.

"We are in an era of exponential data growth. It matters to redefine the traditional IT architecture to bring operational agility and economic advantages to our customers." said a senior executive of Ingrasys.

This year Ingrasys makes a significant breakthrough in simplifying server hardware while enabling the necessary complexity to serve today's varied applications. Ingrasys introduces Modular Server as the next generation product – the traditional legacy servers are sub-divided into logical modules, such as HPM (host processor module), DC-SCM (datacenter secure control module), high-speed I/O, chassis, etc. Both x86 and Arm-based HPMs are now being developed with the same size to respectively fit EIA 19" and ORv3 chassis, and one DC-SCM can support multiple CPU platforms to create maximum configurations.

"With such flexibility, we can mix and match modules to configure the new systems for workloads of today and tomorrow," said the executive.

Other innovations are also displayed at the booth, ranging from products to solutions, such as datacenter building blocks to edge computing products, the composable infrastructure solution, advanced cooling technology, and autonomous driving.

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